Conventional FIB ex-situ lift-out is the most common technique for precise TEM sample preparation. But this method has some limitations and so in-situ lift-out technique was developed to overcome these drawbacks. The in-situ lift-out technique lifts-out the sample and then attaches the sample to a half-cut copper grid inside the FIB chamber by mini-probing system. This paper introduces a novel and simple technique that can overcome the above problems and a wide application of TEM samples preparation. The examples highlighted here demonstrate the novel method of low cost and high image quality TEM sample preparation. The method can reduce the amorphous phenomenon on the sidewall of specimen; no shield effect was found during the reprocess of thinning by ion-miller; and no contamination induced by the ion-miller sputtering was formed.

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