In many cases it is difficult to distinguish mechanical damage from electrostatic surface impacts. In recent years, several investigations have resulted in publications on ESDFOS (Electrostatic Discharge From Outside to Surface). While the diagnostics of the phenomena have been worked out quite well for wafers with aluminum metallization, no formal studies on ESDFOS impact to copper-metallized wafers have been published. This paper investigates physical features of Cu-metallized wafers artificially exposed to ESDFOS impacts of variable severity, producing an understanding of damage features to more easily facilitate recognition of EDSFOS events.

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