As the number of dice stacked within a microelectronic package increases, the need to maintain die surface integrity also increases. In this paper, one assembly packaging-related rootcause mechanism about passivation-metal damage (PMD) will be featured. The profile of inter-die adhesive was found to play an important role to maintain the integrity of die surface as more dice are stacked in a microelectronic package. Recommended solution to prevent this type of failure will be discussed.
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Issue Section:Package and Assembly Level Failure Analysis