As the number of dice stacked within a microelectronic package increases, the need to maintain die surface integrity also increases. In this paper, one assembly packaging-related rootcause mechanism about passivation-metal damage (PMD) will be featured. The profile of inter-die adhesive was found to play an important role to maintain the integrity of die surface as more dice are stacked in a microelectronic package. Recommended solution to prevent this type of failure will be discussed.

adhesives, die surface integrity, microelectronic packages, passivation-metal damage, root cause analysis
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Copyright © 2007 ASM International. All rights reserved.
2007
ASM International
Topics
Adhesives Semiconductor wafer fabrication Root cause analysis
Issue Section:
Package and Assembly Level Failure Analysis
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