In this paper, a case of package level reliability test failure was studied. A model of “Slice Defect”, which was identified as the root cause by failure analysis, is introduced. Experiment results are presented to approve that such model is in fact correct and the corrective actions are effective.

electronic packages, metal slice defects, reliability test, root cause analysis
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Copyright © 2006 ASM International. All rights reserved.
2006
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Reliability testing Root cause analysis
Issue Section:
Analytical Process
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