This article presents a novel method to provide whole Deep Trench (DT) profile inspection. Bevel angle top-down polishing is used on pre-rotated substrates instead of traditional cross-section cleaving. This method can feedback the precise DT profile shape at specific depths to the production line for process tuning and troubleshooting.

90 nm process, deep trench profile inspection, DRAM, failure analysis, polishing, process monitoring
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Copyright © 2006 ASM International. All rights reserved.
2006
ASM International
Topics
Lapping and polishing
Issue Section:
Metrology and Materials Analysis
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