Abstract

Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

delamination, humidity, light-emitting diode chips, microcracks, printed-circuit boards, reliability analysis, surface mount process, temperature
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Copyright © 2006 ASM International. All rights reserved.
2006
ASM International
Topics
Semiconductor wafer fabrication Reliability analysis Elevated temperature life testing
Issue Section:
Discrete Devices
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