Abstract

The bump nodule growing in electroplating process could be large enough to induce bump to bump short even if the nodule would be weaken by re-flow process. In this work, the microstructure of PbSn eutectic bump and Au bump nodules was analyzed with FIB, SEM and EDS. In PbSn eutectic bump nodule, void defects can be observed with FIB imaging. In Au bump nodule, radiation-like grain structure around the center of Silicon-contained particle can be observed. Based on those analysis results, voids and particles are the source of bump nodule growth. The reason for bump nodule formation is that particles, voids and cathode morphology defects change the roughness of cathode surface, which induces a higher current density area and accelerate local electrocrystallization. Generally, particles, voids and cathode morphology defects are caused by poor photolithography process, tank corrosion and anode contamination such as passivation membrane. Therefore, three conclusions are proposed in this work: 1) where and when the nodules grow can be identified according to their microstructures; 2) cleaning tank and anode periodically can effectively prevent the bump nodules; 3) Qualified photo resist (PR) coating and PR opening process are essential to prevent bump nodule defects.

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