Driven by ever increasing pin-counts and device performance, analyses of multi-layer package substrate failures are increasingly challenging. The tried method of global deprocessing delivers diminishing returns. Increasingly, an entire suite of specialized package analysis tools is needed to complement each other and achieve root-cause.

integrated circuit deprocessing, integrated circuit package analysis, root cause analysis
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Copyright © 2005 ASM International. All rights reserved.
2005
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Root cause analysis
Issue Section:
System Level Analysis
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