A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.

300mm process, failure analysis, integrated circuits, semiconductor wafer quality, silicon on insulator
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Copyright © 2005 ASM International. All rights reserved.
2005
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Metrology and Materials Analysis
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