Abstract
During yield ramp, quick turnaround times between production failures and the results of physical failure analysis are essential. In spite of the growing complexity of today's logic designs, a fast defect localization can be done by using diagnostic features implemented within standard test pattern generation tools. The diagnosis result can not only be used for fault localization but also for statistical analysis based on a large number of failing chips. This statistical approach enables the search for systematic yield detractors and leads to a faster product or technology ramp. This paper describes the necessary steps in order to set up statistical scan diagnosis, discusses the main failure analysis strategies and gives experimental results.
