AOC herein describes a collection of material degradation features observed in Vertical Cavity Surface Emitting Lasers (VCSELs) that have been intentionally degraded with a range of electrostatic discharge (ESD) stress conditions. Failure analysis techniques employed include emission microscopy, Focused Ion Beam (FIB) microscopy and Transmission Electron Microscopy (TEM). The results have enabled higher confidence in root-cause determination for failed VCSEL devices.

electrostatic discharge, emission microscopy, focused ion beam, material degradation, root cause analysis, transmission electron microscopy, vertical-cavity surface emitting lasers
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Copyright © 2005 ASM International. All rights reserved.
2005
ASM International
Topics
Transmission electron microscopy Semiconductor wafer fabrication Root cause analysis Test method evaluation
Issue Section:
Optoelectronic Devices
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