In this paper we report on the application field of Dynamic Laser Stimulation (DLS) techniques to Integrated Circuit (IC) analysis. The effects of thermal and photoelectric laser stimulation on ICs are presented. Implementations, practical considerations and applications are presented for techniques based on functional tests like Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). A new methodology, Delay Variation Mapping (DVM), will also be presented and discussed.

delay variation mapping, failure analysis, integrated circuit analysis, laser assisted device alteration, photoelectric laser stimulation, soft defect localization, thermal laser stimulation
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Copyright © 2005 ASM International. All rights reserved.
2005
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Optical Techniques
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