Abstract

New package technologies are getting more complex, and thus isolating defects is becoming more challenging [1]. Analytical tools like Scanning SQUID Microscopes (SSM) are thus gaining relevance based on the capability to non-destructively detect electrical fails in very complex package technologies [2]. In this paper we report the use of SSM for the nondestructive isolation of electrical fails in novel microelectronic packages, where SSM has been found to be a unique fault isolation technique.

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