In-Line Repair of Detectable, Same-Level, Killer Defects Affecting IC Chips

In-line repair of same-level killer defects is suggested as a method of the future for achieving higher yields. A methodology describing selection of killer defects and how to repair them is presented. A proof of concept experiment is presented where killer defects are removed from comb test structures using a FIB. An economic analysis is also included which indicates that this technique is economically viable for more costly chip designs. Therefore additional development work is merited.