A new via interconnect failure mode found in organic light emitting diode (OLED) displays has been documented. Physical appearance, electrical performance, response to environmental stresses and root cause analyses have been studied using both simplistic and sophisticated failure analysis tools including focused ion beam etching and time of flight secondary ion mass spectroscopy (TOF-SIMS).

focused ion beam etching, organic light emitting diode, root cause analysis, time of flight secondary ion mass spectroscopy
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Copyright © 2004 ASM International. All rights reserved.
2004
ASM International
Topics
Root cause analysis Time-of-flight secondary ion mass spectrometry
Issue Section:
Optoelectronic Devices
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