An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.

electronic devices, failure analysis, MEMS sensor, microelectronic packaging
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Copyright © 2004 ASM International. All rights reserved.
2004
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Microelectromechanical Systems
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