Overcoming Environmentally Induced Probe Drift for Sub-300nm Fault Isolation

This paper defines environmentally induced probe drift and elaborates on the problems and challenges associated with it as they relate to physical sub-micron fault isolation systems. Vibration, acoustical, and thermal disturbances are discussed. Probing hardware that can be affected by environmental conditions will be summarized. A comparison of the different approaches is presented with the “pros” and “cons” of each approach summarized. Optimal methods of managing probe drift are presented to give the reader a complete understanding of how environmentally induced probe drift may impact their own physical sub-micron fault isolation. Examples, images, and device data are presented when appropriate.