Abstract

In modern integrated circuits (IC) using sub-micron or deep sub-micron process rules, substrate dislocation is a common failure mechanism in SRAM or embedded SRAM products. Depending on the position of substrate dislocation in the SRAM cell, it may result in problems including junction or contact leakage, gate oxide early breakdown, low threshold voltage, and poor data retention. In this paper, we’ll focus on the test methodology and physical failure analysis to dig out the failure mechanism, substrate dislocation under SRAM pass gate and node contact. In addition, we will measure the electrical behavior of such substrate dislocation. Several FA techniques, such as Passive Voltage Contrast (PVC) [1] pad deposition by Focus Ion Beam (FIB), and electrical micro probing [2] will be used during leakage verification and measurement.

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