Abstract

Preparing Laser Interferometer (Moiré) samples involves several steps that can be time consuming and labor intensive. This process requires diligence and discipline in order to create a successful sample. Previous Moiré sample preparation methods have yielded <30% for component characterization. The sample preparation presented in this document has increased yield to approximately 90%. Improvements are the result of optimized tooling and a novel epoxy application technique. Prepared laser interferometer samples are used to subsequently reveal inplane strain and residual stresses present at the component of interest. Two applications that benefit from Moiré are as follows: 1) inelastic strains due to deflection or thermal cycling, and 2) elastic coefficient of thermal expansion effects resulting from high temperature cure to ambient temperature. In the first case, the inelastic strain is typical due to permanent residual deformation. In the second case, the thermal expansion effects are the result of growing and bending and then coming back to normal position. In this presentation both the ambient (inelastic) and the high temperature (elastic) sample preparation techniques will be covered in detail, thus providing the end user great success in capturing strain data.

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