This paper describes techniques to prepare integrated circuit (IC) samples, containing a Thick Organic Dielectric (TOD) over Cu inductors, for Scanning Electron Microscopy (SEM) or Focused Ion Beam (FIB) editing. Our technique utilizes mechanical polishing and UV laser ablation in lieu of chemical decapsulation and deprocessing.

chemical decapsulation, copper inductors, failure analysis, focused ion beam editing, integrated circuits, mechanical polishing, organic dielectrics, scanning electron microscopy, UV laser ablation
This content is only available as a PDF.
Copyright © 2003 ASM International. All rights reserved.
2003
ASM International
Topics
Specimen preparation Scanning electron microscopy
Issue Section:
Sample Preparation
You do not currently have access to this content.