Abstract
In this paper, the temperature distributions around interconnect defects due to electromigration are presented. A method to overlay the temperature distribution over the optical microscope image of the physical defect has also been developed. This allows a direct correlation of the temperature distribution and the physical structure of the defect.
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Copyright © 2003 ASM International. All rights reserved.
2003
ASM International
Issue Section:
Scanning Probe Microscopy
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