For both FSG or C-doped oxide samples containing copper (Cu) metallization, Cu was often dissolved during wet delineation steps for cross-sectional SEM samples. Length effect was the important factor for avoiding Cu dissolution during wet delineation process. This paper presents practical methods to prevent Cu damage for FIB cross-sectional and mechanical polished SEM samples.

This content is only available as a PDF.
You do not currently have access to this content.