In this paper, a failure analysis case, which uses a dynamic operation technique and MgCdTe (MCT) camera to isolate single scan-chain failed cell is demonstrated. Improved results obtained using the MgCdTe (MCT) camera is compared with traditional Si CCD camera. Scan-chain cell schematic and failure mechanism is also presented to explain why static bias conditions are insufficient to detect this failure.

failure analysis, infrared detectors, mercury cadmium telluride camera, scan chain
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Copyright © 2003 ASM International. All rights reserved.
2003
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Poster Session
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