The use of Dynamic Infrared (IR) Imaging is presented as a novel, valuable and non-destructive approach for the analysis and isolation of failures at a system/component level.

audio video interleave, failure analysis, fault isolation, IR thermography, system under test
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Copyright © 2003 ASM International. All rights reserved.
2003
ASM International
Topics
Semiconductor wafer fabrication Infrared thermography
Issue Section:
System Level Analysis
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