This article discusses the techniques useful in the failure discovery process in PC motherboard. It discusses the application of infrared (IR) camera in failure analysis, which overcomes time consumption problems. The article focuses on the experience gained from nine different case studies, where IR thermography system was used to both measure relative temperatures as well as absolute temperatures of components. The failures investigated are overdriven components, finding end-of-life but still functional components, correctly specified components with quality defects, incorrect component placement, internal voltage common collector to ground low resistance integrated circuits failures, PCB defects resulting in power to ground failures, soldering defects resulting in lead opens or solder bridges, and copper trace manufacturing defects or stress-induced cracks.

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