Abstract

In this paper we described a technique which is not commonly used for failure analysis: Orientation Imaging Microscopy (OIM). We demonstrated that it offers unique opportunity for failure analysis of Cu bonding and interconnects. Additionally to its main application: texture analysis, it can also reveal early stages of oxidation of Cu bond pads and interconnects. A link has been made between oxidation and bondability. OIM can also show areas of the wire bond where the deformation concentrates due to the bonding process.

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