A breakthrough approach was developed in which failure analysis (FA) of advanced microprocessor was carried out without the use of defect localization equipment. This technique enables the reading of internal signal value without the use of any physical probing method. This method demonstrates the same FA capability with higher success rate and shorter analysis time.

failure analysis, microprocessors
This content is only available as a PDF.
Copyright © 2002 ASM International. All rights reserved.
2002
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Failure Analysis Process
You do not currently have access to this content.