In this paper we discuss reliability and failure analysis issues of RF-MEMS capacitive switches. We describe specific instrumentation and methods that can be used for testing and examination of these switches. These include SEM, AFM, SAM, static and dynamic optical investigation and electrical lifetime testing. Processing as well as testing and packaging issues are discussed.

atomic force microscopy, capacitive switches, electrical lifetime testing, failure analysis, microelectromechanical system, radio frequency, reliability analysis, scanning acoustic microscopy, scanning electron microscope
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Copyright © 2002 ASM International. All rights reserved.
2002
ASM International
Topics
Scanning electron microscopy Atomic force microscopy Scanning acoustic microscopy Semiconductor wafer fabrication Reliability analysis
Issue Section:
Microelectromechanical Systems
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