Three techniques have been developed for TEM sample preparation to improve efficiency in terms of time reduction and success rate. The first technique is to closely control the thickness of a sample for a specific area to less than 10µm by mechanical polishing before undergoing FIB thinning. The second one is to repair cracks produced during mechanical polishing before further milling in the ion miller. The last one is to provide an in-FIB remedy for face-to-face cross-sectional samples, which peel from each other during mechanical polishing. These new techniques will substantially enhance the success rate and turnaround time for TEM sample preparation.