Modern package technologies like flip-chip, require measurements of transient signals from the chip backside [1], [2]. This is because frontside access is not possible while running a test pattern. This is an established method for CMOS devices and commercial equipment is available. This paper demonstrates the usefulness of a Laser- Voltage-Prober for transient signal measurements from the backside on bipolar-devices.

bipolar devices, CMOS devices, failure analysis, flip-chip packages, laser voltage prober
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Copyright © 2002 ASM International. All rights reserved.
2002
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Poster Session
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