Abstract

Modern package technologies like flip-chip, require measurements of transient signals from the chip backside [1], [2]. This is because frontside access is not possible while running a test pattern. This is an established method for CMOS devices and commercial equipment is available. This paper demonstrates the usefulness of a Laser- Voltage-Prober for transient signal measurements from the backside on bipolar-devices.

This content is only available as a PDF.
You do not currently have access to this content.