Visible to infra-red photon emissions can be readily observed in compound semiconductor devices through the semi-insullating substrate and are useful in fault identification when analyzing yield problems. The techniques described here have uncovered several yield-limiting mechanisms and have lead to rapid and effective corrective measures.

failure analysis, fault identification, infrared microthermography, semiconductor devices
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Copyright © 2002 ASM International. All rights reserved.
2002
ASM International
Topics
Semiconductor wafer fabrication Infrared thermography
Issue Section:
Poster Session
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