Backside imaging through a silicon substrate introduces spherical aberration at high numerical apertures. For a typical 200 micron substrate thickness, these aberrations limit the resolution to less than 1 micron. A theoretical analysis of the aberrations describes the limiting factors. Means for correcting for these aberrations are described.

electronic devices, failure analysis, silicon, spherical aberration
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Copyright © 2002 ASM International. All rights reserved.
2002
ASM International
Topics
Semiconductor wafer fabrication Silicon
Issue Section:
Poster Session
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