This paper describes the use of a Nd:YAG laser to validate logical to physical mapping of embedded arrays found on devices packaged in “flip-chip” configurations.

failure analysis, flip-chip packages, Nd:YAG laser, semiconductor devices
This content is only available as a PDF.
Copyright © 2001 ASM International. All rights reserved.
2001
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Defect-Based Testing
You do not currently have access to this content.