The work presented in this paper concerns the characterization of MEMS structures, industrially manufactured using front-side bulk micromachining post-process techniques on CMOS dies. The systematic characterization of mechanical parameters, such as stiffness or mass, on a set of 100 cantilever devices provide us with basic knowledge concerning process parameter variations.

CMOS, failure analysis, microelectromechanical systems, micromachining
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Copyright © 2001 ASM International. All rights reserved.
2001
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Micro Electromechanical Systems
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