Abstract

Two novel techniques to identify continuity failures in multi-layer substrates of flip-chip package are discussed. The first technique uses the custom designed and fabricated Package Substrate Probe Fixture (PSPF™). The fixture eliminates the traditional method of soldering directly to the package solder balls. This ensures that failures are not heat cured and the solder ball as well as the Ball Grid Array (BGA) pad are not detached from the package substrate during physical analysis. Also employed are beam-based systems that include both Focused Ion Beam (FIB) and Electron-beam (Ebeam) to detect Capacitive Coupling Voltage Contrast (CCVC) images. Voltage contrast imaging augments traditional optical inspection techniques using bright and dark field microscopy.

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