X-Ray Tomography of Integrated Circuit Interconnects: Past and Future

Levine, Zachary H.; Grantham, Steven

doi:10.31399/asm.cp.istfa2001p0011

ISTFA 2001

November 11–15, 2001

Santa Clara, California, USA

Conference Sponsors:

ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis

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X-Ray Tomography of Integrated Circuit Interconnects: Past and Future

Zachary H. Levine;

Zachary H. Levine

National Institute of Standards

,

Gaithersburg, MD

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Steven Grantham

National Institute of Standards

,

Gaithersburg, MD

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Paper No: istfa2001p0011, pp. 11-13; 3 pages

https://doi.org/10.31399/asm.cp.istfa2001p0011

Published Online: October 01 2001

Abstract

A scanning transmission x-ray microscope was used to perform x-ray tomography of integrated circuit interconnects. Reconstructions of test circuits were made with 140 nm 3D resolution in the best case.

failure analysis, integrated circuits, scanning transmission X-ray microscope, X-ray tomography

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2001

ASM International

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X-Ray Tomography of Integrated Circuit Interconnects: Past and Future

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