A method of fabricating fixtures for chemical decapsulation of plastic packages is presented. Fixtures built using this technique can easily decapsulate very small or unique plastic packages, such as the SC70, SOT123, μMax and others. The method uses materials and tools commonly found in the FA lab.

chemical decapsulation, failure analysis, plastic packages, transistors
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Copyright © 2001 ASM International. All rights reserved.
2001
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Poster Session
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