A new Au etch, recently developed for selective Au etching on Ti/Pt/Au metallization of optoelectronic devices, has been tested on Au wires bonded on Al films. Contrary to theoretical expectations, Au wires are removed without Al damage, except for a very localized area around the bond interface. The role of the native Al oxide is discussed in preserving Al and allowing Au lift off.

aluminum, failure analysis, gold etching, integrated circuits, metallization, optoelectronic devices
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Copyright © 2000 ASM International. All rights reserved.
2000
ASM International
Topics
Metallization Semiconductor etching Aluminum Gold
Issue Section:
Techniques
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