Surface changes of copper and copper coupons coated with organic solderability preservative (OSP) after accelerated aging were measured using UV Differential Reflectance Spectroscopy. A chemometric method has been developed that allows correlation of the spectroscopic results with independent measurements of the solderability of the copper and copper/OSP coupons using a wetting balance or sequential electrochemical reduction analysis (SERA). Based on the results of this study, a versatile instrument for the assessment of the solderability of printed wiring boards has been demonstrated. The instrument is currently in beta testing at several locations.

accelerated aging, beta testing, chemometric methods, coating, copper oxides, copper, organic solderability preservative, printed wiring boards, sequential electrochemical reduction analysis, UV differential reflectance spectroscopy
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Copyright © 2000 ASM International. All rights reserved.
2000
ASM International
Topics
Coating Scanning electron microscopy Semiconductor wafer fabrication Solderability Accelerated aging testing Copper
Issue Section:
Poster Session
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