Flip Chip packaging requires an understanding of the solder bump metallurgy and its aging characteristics. In this paper we demonstrate how standard failure analysis techniques can help determine aging characteristics and, how an understanding of bump age can be successfully employed to enhance bump reliability.

failure analysis, flip chip packaging, high temperature operational life, reliability analysis, solder bumps
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Copyright © 1998 ASM International. All rights reserved.
1998
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Reliability analysis
Issue Section:
Packaging
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