Abstract

In the never ending battle for smaller, faster, cheaper semiconductors, ESD protection is more and more becoming a driving factor. Since scaling the ESD protection devices usually means scaling the level of protection as well, methods for providing good ESD robustness in less real estate are required. By placing some ESD circuitry under the bond pads and maintaining good control over the wire bond process, good ESD levels can be obtained, excellent reliability can be achieved and significant die area can be saved.

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