Abstract

C4 (Controlled Collapse Chip Connection) failure analysis compared to conventional packages (DIP- LCC- QFP, etc.) is not trivial. For instance, one has to thin the C4 die for IR microscope inspection or for photon emission analysis. Then, after failure analysis on the die, it must be removed for deprocessing or further analysis. Three methods and techniques will be discussed for removing the C4 die from the package without damaging the die. However, for each technique it is very important to know the condition of the die and package prior to die removal. The method used will differ, for example, if the die is thinned or not.

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