Single Contact Electron Beam Induced Current Microscopy for Failure Analysis of Integrated Circuits

Single Contact Electron Beam Induced Current (SCEBIC) microscopy, a new junction imaging technique suitable for visualization of unconnected pn junctions in integrated circuits is presented. By using the substrate contact alone of a die, the SCEBIC approach eliminates the need to connect a junction to the imaging electronics as is done in the conventional Electron Beam Induced Current (EBIC) technique. The principles of SCEBIC are discussed and experimental data which validate the SCEBIC approach for imaging of pn junctions is presented. Examples of SCEBIC images are presented and applications of SCEBIC microscopy in IC failure analysis are discussed.