Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.

electrical overstress, IC devices, package delamination, scanning acoustic microscope, soldering
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Copyright © 1996 ASM International. All rights reserved.
1996
ASM International
Topics
Electronic packaging Scanning acoustic microscopy Semiconductor wafer fabrication
Issue Section:
Packaging
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