A new method of signature analysis is presented and explained. This method of signature analysis can be based on either experiential knowledge of failure analysis, observed data, or a combination of both. The method can also be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. The model is developed in the paper and an example is given for its use.

Dempster-Shafer theory, failure analysis, integrated circuits, signature analysis
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Copyright © 1996 ASM International. All rights reserved.
1996
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Signature Analysis
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