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Defect localization
- Infrared emission microscopy (IREM)
- In-line inspection
- Laser assisted device alteration (LADA)
- Laser voltage imaging (LVI)
- Lock-in thermography
- Nanoprobing
- Optical beam induced resistance change (OBIRCH)
- Soft defect localization (SDL)
- Time domain reflectometry (TDR)
Deprocessing and sample preparation
- Backside sample preparation
- Decapsulation
- Focused ion beam (FIB) milling
- Laser ablation
- Lift out techniques
- Reactive ion etching (RIE) techniques
Electrical characterization techniques
- Conductive atomic force microscopy (C-AFM)
- Dynamic laser stimulation (DLS)
- Electron beam induced current (EBIC) analysis
- Laser voltage probing (LVP)
- Magnetic current imaging (MCI)
- Optical beam induced current (OBIC) analysis
- Passive voltage contrast (PVC)
- Scanning probe microscopy (SPM)
Failure analysis examples
Failure types and mechanisms
- Corrosion
- Delamination
- Electrical overstress (EOS)
- Electrostatic discharge (ESD)
- Tungsten plug defects
Imaging tools and techniques
- Atomic force microscopy (AFM)
- Energy dispersive X-ray (EDX) analysis
- Focused ion beam (FIB) tomography
- Scanning acoustic microscopy (SAM)
- Scanning electron microscopy (SEM)
- Scanning transmission electron microscopy (STEM)
- Three-dimensional microscopy
- Transmission electron microscopy (TEM)
- X-ray tomography
Package level failure analysis
Special topics
- Circuit edit techniques
- Circuit modification and repair
- Counterfeit integrated circuit (IC) detection
- Dopant profiling
- Reverse engineering
- Yield improvement and enhancement