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Proceedings Papers

ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis

3D Devices Failure Analysis

Artificial Intelligence Application for Failure Analysis

Board and System Level Failure Analysis

Case Studies—Device Analysis

Die Level Fault Isolation

Emerging Failure Analysis Techniques and Concepts

FIB Circuit Analysis and Edit

FIB Sample Preparation

Hardware Attacks, Security, and Reverse Engineering

Microscopy and Material Analysis

Nanoprobing, Electrical Characterization

Package Level Fault Isolation

Packaging and Assembly Level Failure Analysis

Poster Session

Product Yield, Test, and Diagnostics

Sample Preparation and Device Deprocessing

Scanning Probe Analysis

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