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Proceedings Papers

ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

Artificial Intelligence Applications for Failure Analysis

Board and System Level Failure Analysis

Case Studies: Device Analysis

Case Studies: Failure Analysis Processes

Detecting and Preventing Counterfeit Microelectronics

Die Level Fault Isolation

Emerging Failure Analysis Techniques and Concepts

FIB Circuit Analysis and Edit

FIB Sample Preparation

Hardware Attacks, Security, and Reverse Engineering

Microscopy and Material Characterization

Nanoprobing and Electrical Characterization

Poster Session

Product Yield, Test, and Diagnostics

Sample Preparation and Device Deprocessing

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