Proceedings Papers

Artificial Intelligence Applications for Failure Analysis

Report Classification for Semiconductor Failure Analysis

Frederik Platter; Anna Safont-Andreu; Christian Burmer; Konstantin Schekotihin

ISTFA 2021; 1-5https://doi.org/10.31399/asm.cp.istfa2021p0001

Abstract

View Articletitled, Report Classification for Semiconductor Failure Analysis

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Analysis of Time-Resolved Thermal Responses in Lock-In Thermography by Independent Component Analysis (ICA) for a 3D Spatial Separation of Weak Thermal Sources and Defects

Michael Kögel; Sebastian Brand; Christian Große; Frank Altmann; Kristof J. P. Jacobs; Ingrid De Wolf

ISTFA 2021; 6-11https://doi.org/10.31399/asm.cp.istfa2021p0006

Abstract

View Articletitled, Analysis of Time-Resolved Thermal Responses in Lock-In Thermography by Independent Component Analysis (ICA) for a 3D Spatial Separation of Weak Thermal Sources and Defects

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Logo Classification and Data Augmentation Techniques for PCB Assurance and Counterfeit Detection

Mukhil Azhagan Mallaiyan Sathiaseelan; Olivia P. Paradis; Rajat Rai; Suryaprakash Vasudev Pandurangi; Manoj Yasaswi Vutukuru; Shayan Taheri; Navid Asadizanjani

ISTFA 2021; 12-19https://doi.org/10.31399/asm.cp.istfa2021p0012

Abstract

View Articletitled, Logo Classification and Data Augmentation Techniques for PCB Assurance and Counterfeit Detection

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Machine Learning Based Optimization Technique for High-Capacity V-NAND Flash Memory

Jisuk Kim; Earl Kim; Daehyeon Lee; Taeheon Lee; Daesik Ham; Miju Yang; Wanha Hwang; Jaeyoung Kim; Sangyong Yoon; Youngwook Jeong; Eunkyoung Kim; Ki-Whan Song; Jai Hyuk Song; Myungsuk Kim; Woo Young Choi

ISTFA 2021; 20-22https://doi.org/10.31399/asm.cp.istfa2021p0020

Abstract

View Articletitled, Machine Learning Based Optimization Technique for High-Capacity V-NAND Flash Memory

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Using Ontologies in Failure Analysis

Anna Safont-Andreu; Christian Burmer; Konstantin Schekotihin

ISTFA 2021; 23-28https://doi.org/10.31399/asm.cp.istfa2021p0023

Abstract

View Articletitled, Using Ontologies in Failure Analysis

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Board and System Level Failure Analysis

Locate Faulty Components by IR Based Direct Current Injection Method with Analog Signature Analysis

Zhifeng Zhu; Paul Leone

ISTFA 2021; 29-33https://doi.org/10.31399/asm.cp.istfa2021p0029

Abstract

View Articletitled, Locate Faulty Components by IR Based Direct Current Injection Method with Analog Signature Analysis

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Case Studies: Device Analysis

Failure Analysis Challenges of Phase Change Memory Test Structures with Two Case Studies

J. Demarest; N. Arnold; K. Brew; V. Chan; A. Cote; T. Gordon; M. Iwatake; G. Lian; J. Li; I. OK; S. McDermott; I. Saraf; N. Saulnier; L. Tierney; A. Varghese

ISTFA 2021; 34-39https://doi.org/10.31399/asm.cp.istfa2021p0034

Abstract

View Articletitled, Failure Analysis Challenges of Phase Change Memory Test Structures with Two Case Studies

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The Effect of Wafer Edge Cu Contamination on FinFET Devices

Yong Guo; Jason Jones; Yanan Guo; Jeff Hurst; Jinyoung Lee; Stuart Son

ISTFA 2021; 40-43https://doi.org/10.31399/asm.cp.istfa2021p0040

Abstract

View Articletitled, The Effect of Wafer Edge Cu Contamination on FinFET Devices

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Semiconductor Failure Analysis in the Automotive Industry at BMW: From X-Ray Microscopy to ToF-SIMS Measurements on a STEM Lamella

D. Braun; S. Diez; J. Kopitzke

ISTFA 2021; 44-48https://doi.org/10.31399/asm.cp.istfa2021p0044

Abstract

View Articletitled, Semiconductor Failure Analysis in the Automotive Industry at BMW: From X-Ray Microscopy to ToF-SIMS Measurements on a STEM Lamella

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Large-Scale CT Inspection of Feed-Through EMI Filters for Space Application

John Bescup

ISTFA 2021; 49-52https://doi.org/10.31399/asm.cp.istfa2021p0049

Abstract

View Articletitled, Large-Scale CT Inspection of Feed-Through EMI Filters for Space Application

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Case Studies: Failure Analysis Processes

High Aspect Ratio Vertical Bipolar Junction Transistor NPN Device Fault Isolation and Analysis Techniques

Kevin Distelhurst; Dan Bader

ISTFA 2021; 53-58https://doi.org/10.31399/asm.cp.istfa2021p0053

Abstract

View Articletitled, High Aspect Ratio Vertical Bipolar Junction Transistor NPN Device Fault Isolation and Analysis Techniques

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Detecting and Preventing Counterfeit Microelectronics

Scanning Acoustic Microscopy Package Fingerprint Extraction for Integrated Circuit Hardware Assurance

Daniel Johnson; Po-Wei Hsu; Chengjie Xi; Navid Asadizanjani

ISTFA 2021; 59-64https://doi.org/10.31399/asm.cp.istfa2021p0059

Abstract

View Articletitled, Scanning Acoustic Microscopy Package Fingerprint Extraction for Integrated Circuit Hardware Assurance

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EC-Seg: Electronic Component Segmentation for PCB Assurance and Counterfeit Avoidance

Mukhil Azhagan Mallaiyan Sathiaseelan; Sudarshan Agrawal; Manoj Yasaswi Vutukuru; Navid Asadizanjani

ISTFA 2021; 65-72https://doi.org/10.31399/asm.cp.istfa2021p0065

Abstract

View Articletitled, EC-Seg: Electronic Component Segmentation for PCB Assurance and Counterfeit Avoidance

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Die Level Fault Isolation

Failure Localization Techniques for 7nm and 16nm Process Nodes in Monolithic and 2.5D SSIT Packages using OBIRCH, LVP, and Advanced Die Thinning

Daniel Nuez; Phoumra Tan; Daisy Lu; Benhai Zhang; Joshua Miller; Mark Lynaugh; Tom Harper; Michael DiBattista; Scott Silverman

ISTFA 2021; 73-79https://doi.org/10.31399/asm.cp.istfa2021p0073

Abstract

View Articletitled, Failure Localization Techniques for 7nm and 16nm Process Nodes in Monolithic and 2.5D SSIT Packages using OBIRCH, LVP, and Advanced Die Thinning

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SRAM Bitcell Defect Identification Methodology Using Electrical Failure Analysis Data

Hyungtae Kim; Geonho Kim; Yunrong Li; Jinyong Jeong; Youngdae Kim

ISTFA 2021; 80-83https://doi.org/10.31399/asm.cp.istfa2021p0080

Abstract

View Articletitled, SRAM Bitcell Defect Identification Methodology Using Electrical Failure Analysis Data

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Pushing Failure Mode Stimulus to Overcome the Limitations and Boundaries of Soft Defect Localization Tools

Allan Norico; Rommel Estores

ISTFA 2021; 84-95https://doi.org/10.31399/asm.cp.istfa2021p0084

Abstract

View Articletitled, Pushing Failure Mode Stimulus to Overcome the Limitations and Boundaries of Soft Defect Localization Tools

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Emerging Failure Analysis Techniques and Concepts

Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope

Sean M. Oliver; Dmitro J. Martynowych; Matthew J. Turner; David A. Hopper; Ronald L. Walsworth; Edlyn V. Levine

ISTFA 2021; 96-107https://doi.org/10.31399/asm.cp.istfa2021p0096

Abstract

View Articletitled, Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope

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Heterogeneous Industry Collaboration and System CAD Navigation for Advanced Package Failure Analysis

Arpan Bhattacherjee; Anand Shankar; Arshdeep Singh; Mehak Singla

ISTFA 2021; 108-114https://doi.org/10.31399/asm.cp.istfa2021p0108

Abstract

View Articletitled, Heterogeneous Industry Collaboration and System CAD Navigation for Advanced Package Failure Analysis

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Photon Emission Microscopy of HfO₂ ReRAM Cells

Franco Stellari; Ernest Y. Wu; Takashi Ando; Martin M. Frank; Peilin Song

ISTFA 2021; 115-121https://doi.org/10.31399/asm.cp.istfa2021p0115

Abstract

View Articletitled, Photon Emission Microscopy of HfO₂ ReRAM Cells

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FIB Circuit Analysis and Edit

Back Side Illumination Image Sensor Characterization by Backside Circuit Editing

Jian Yu; Jin Xu; Niel Sanico

ISTFA 2021; 122-125https://doi.org/10.31399/asm.cp.istfa2021p0122

Abstract

View Articletitled, Back Side Illumination Image Sensor Characterization by Backside Circuit Editing

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FIB Sample Preparation

Automated TEM Workflow for Inline Defect Characterization

Hyun Woo Shim; Taehun Lee; Jonghan Kwon

ISTFA 2021; 126-129https://doi.org/10.31399/asm.cp.istfa2021p0126

Abstract

View Articletitled, Automated TEM Workflow for Inline Defect Characterization

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Thickness Control and Targeting in Large Scale Automated XTEM Lamella Preparation

Vikas Dixit; Bryan Gauntt; Taehun Lee

ISTFA 2021; 130-134https://doi.org/10.31399/asm.cp.istfa2021p0130

Abstract

View Articletitled, Thickness Control and Targeting in Large Scale Automated XTEM Lamella Preparation

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Accurate Sub-micron Device Delayering of Plan View TEM Specimens By Ar Ion Milling

C.S. Bonifacio; P. Nowakowski; R. Li; M.L. Ray; P.E. Fischione

ISTFA 2021; 135-140https://doi.org/10.31399/asm.cp.istfa2021p0135

Abstract

View Articletitled, Accurate Sub-micron Device Delayering of Plan View TEM Specimens By Ar Ion Milling

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Plasma Etching Pre-treatment for a TEM Lamella Preparation of 3D NAND with High Aspect Ratio

Yu-Chih Chen; Bing-Chang Li; Pei-Ling Hsu; Tsung-Yi Lin; I-An Chen; Chun-Hung Lin; Hsin-Cheng Hsu; Chin-Chih Yeh; Nan-Tzu Lian; Ta-Hone Yang; Kuang-Chao Chen

ISTFA 2021; 141-145https://doi.org/10.31399/asm.cp.istfa2021p0141

Abstract

View Articletitled, Plasma Etching Pre-treatment for a TEM Lamella Preparation of 3D NAND with High Aspect Ratio

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Nanomilling and STEM Imaging of Sub-50 nm InP HEMT

Besmeh F. Raya

ISTFA 2021; 146-149https://doi.org/10.31399/asm.cp.istfa2021p0146

Abstract

View Articletitled, Nanomilling and STEM Imaging of Sub-50 nm InP HEMT

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Plasma FIB Delayering and Nanoprobing with EBIRCH for Localizing Metal Shorts in DRAM

Euiseok Kim; Jaeyun Lee; Jihyun Lee

ISTFA 2021; 150-153https://doi.org/10.31399/asm.cp.istfa2021p0150

Abstract

View Articletitled, Plasma FIB Delayering and Nanoprobing with EBIRCH for Localizing Metal Shorts in DRAM

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Hardware Attacks, Security, and Reverse Engineering

Quantitative Study of Photoelectric Laser Stimulation for Logic State Imaging in Embedded SRAM

S. Chef; C.T. Chua; J.Y. Tay; C.L Gan

ISTFA 2021; 154-162https://doi.org/10.31399/asm.cp.istfa2021p0154

Abstract

View Articletitled, Quantitative Study of Photoelectric Laser Stimulation for Logic State Imaging in Embedded SRAM

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The Role of Cloud Computing in a Modern Reverse Engineering Workflow at the 5nm Node and Beyond

Chris Pawlowicz; Bruno Trindade; Michael Green

ISTFA 2021; 163-171https://doi.org/10.31399/asm.cp.istfa2021p0163

Abstract

View Articletitled, The Role of Cloud Computing in a Modern Reverse Engineering Workflow at the 5nm Node and Beyond

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PCB Netlist Obfuscation with Micro Electro Mechanical Systems and Additive Manufacturing Techniques

John True; Chengjie Xi; Aslam Khan; Josh Hihath; Navid Asadizanjani

ISTFA 2021; 172-178https://doi.org/10.31399/asm.cp.istfa2021p0172

Abstract

View Articletitled, PCB Netlist Obfuscation with Micro Electro Mechanical Systems and Additive Manufacturing Techniques

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Proof of Reverse Engineering Barrier: SEM Image Analysis on Covert Gates

Tasnuva Farheen; Ulbert Botero; Nitin Varshney; Damon L. Woodard; Mark Tehranipoor; Domenic Forte; Haoting Shen

ISTFA 2021; 179-189https://doi.org/10.31399/asm.cp.istfa2021p0179

Abstract

View Articletitled, Proof of Reverse Engineering Barrier: SEM Image Analysis on Covert Gates

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Microscopy and Material Characterization

In-Situ Electrical Biasing of Electrically Connected TEM Lamellae with Embedded Nanodevices

Maria Brodovoi; Kilian Gruel; Lucas Chapuis; Aurélien Masseboeuf; Cécile Marcelot; Martin Hÿtch; Frédéric Lorut; Christophe Gatel

ISTFA 2021; 190-195https://doi.org/10.31399/asm.cp.istfa2021p0190

Abstract

View Articletitled, In-Situ Electrical Biasing of Electrically Connected TEM Lamellae with Embedded Nanodevices

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Submicron Noncontact Simultaneous Infrared and Raman Spectroscopy for Challenging Failure Analysis

Michael K. F. Lo; Jay Anderson; Eoghan P. Dillon; Mustafa Kansiz; Curtis A. Marcott

ISTFA 2021; 196-202https://doi.org/10.31399/asm.cp.istfa2021p0196

Abstract

View Articletitled, Submicron Noncontact Simultaneous Infrared and Raman Spectroscopy for Challenging Failure Analysis

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Early Fault-Analysis Using In-Line Raman Spectroscopy Metrology

D. Fishmana; L. Neemana; N. Meira; Y. Orena; G. Baraka; A. Avidana; J. Ofeka

ISTFA 2021; 203-205https://doi.org/10.31399/asm.cp.istfa2021p0203

Abstract

View Articletitled, Early Fault-Analysis Using In-Line Raman Spectroscopy Metrology

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Low Angle Annular Dark Field Scanning Transmission Electron Microscopy Analysis of Phase Change Material

J. Li; K. Brew; K. Cheng; V. Chan; N. Arnold; A. Gasasira; R. Pujari; J. Demarest; M. Iwatake; L. Tierney; O. Ogundipe; K. Toole; N. Li

ISTFA 2021; 206-210https://doi.org/10.31399/asm.cp.istfa2021p0206

Abstract

View Articletitled, Low Angle Annular Dark Field Scanning Transmission Electron Microscopy Analysis of Phase Change Material

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Application and Optimization of Automated ECCI Mapping to the Analysis of Lowly Defective Epitaxial Films on Blanket or Patterned Wafers

Han Han; Thomas Hantschel; Pieter Lagrain; Clement Porret; Roger Loo; Marina Baryshnikova; Bernardette Kunert; Libor Strakos; Tomas Vystavel

ISTFA 2021; 211-216https://doi.org/10.31399/asm.cp.istfa2021p0211

Abstract

View Articletitled, Application and Optimization of Automated ECCI Mapping to the Analysis of Lowly Defective Epitaxial Films on Blanket or Patterned Wafers

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Recent Developments for the Characterization of Crystals and Defects at the Nanoscale using On-Axis TKD in SEM

Daniel Goran; Thomas Schwager; Alice Bastos DaSilva Fanta

ISTFA 2021; 217-223https://doi.org/10.31399/asm.cp.istfa2021p0217

Abstract

View Articletitled, Recent Developments for the Characterization of Crystals and Defects at the Nanoscale using On-Axis TKD in SEM

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Nanoprobing and Electrical Characterization

Resolution of Customer Return Non-Volatile Memory Data Retention Bit Failures through Bit Map Verification and Bit Cell Characterization by Nanoprobe Analysis

Randal Mulder

ISTFA 2021; 224-240https://doi.org/10.31399/asm.cp.istfa2021p0224

Abstract

View Articletitled, Resolution of Customer Return Non-Volatile Memory Data Retention Bit Failures through Bit Map Verification and Bit Cell Characterization by Nanoprobe Analysis

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Resistive Open Defect Isolation in Nano-Probing

Yunfei Wang; Hyuk Ju Ryu; Tom Tong

ISTFA 2021; 241-247https://doi.org/10.31399/asm.cp.istfa2021p0241

Abstract

View Articletitled, Resistive Open Defect Isolation in Nano-Probing

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Backside EBIRCH Defect Localization for Advanced Flip Chip Failure Analysis

Chuan Zhang; Jane Y. Li; John Aguada; Howard Marks

ISTFA 2021; 248-252https://doi.org/10.31399/asm.cp.istfa2021p0248

Abstract

View Articletitled, Backside EBIRCH Defect Localization for Advanced Flip Chip Failure Analysis

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EBIRCH Localization for Low-Current Soft Fails

Gregory M. Johnson; Andreas Rummel

ISTFA 2021; 253-257https://doi.org/10.31399/asm.cp.istfa2021p0253

Abstract

View Articletitled, EBIRCH Localization for Low-Current Soft Fails

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Pulsing Test for Defect of Resistive Word Line in DRAM Main Cell using WGFMU (Waveform Generator Fast Measurement Unit)

JaeYun Lee; EuiSeok Kim; JunYeal Lim; SeokHoon Oh; YoungHa Park

ISTFA 2021; 258-262https://doi.org/10.31399/asm.cp.istfa2021p0258

Abstract

View Articletitled, Pulsing Test for Defect of Resistive Word Line in DRAM Main Cell using WGFMU (Waveform Generator Fast Measurement Unit)

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Poster Session

Quantile Based Statistical Failure Analysis for Wafer Level Test Comparison

Jeongwon Bae; Minjoo Kim; Jongbum Lee; Myunghoon Oak; Choongsun Park; Sunghun Park; Sungsoo Yim; Heeil Hong; Jooyoung Lee

ISTFA 2021; 263-268https://doi.org/10.31399/asm.cp.istfa2021p0263

Abstract

View Articletitled, Quantile Based Statistical Failure Analysis for Wafer Level Test Comparison

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Chip Recombination Method in Planar Deprocessing – A Solution for Failure Analysis on Chip Edge Defects

Kah Chin Cheong; Gabriel Pragay; Wiwy Wudjud; Rafael Lainez

ISTFA 2021; 269-273https://doi.org/10.31399/asm.cp.istfa2021p0269

Abstract

View Articletitled, Chip Recombination Method in Planar Deprocessing – A Solution for Failure Analysis on Chip Edge Defects

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A New Delayering Application Workflow in Advanced 5nm Technology Device with Xenon Plasma Focus Ion Beam Microscopy

Ha Young Choi; Seo Jin Kim; Christopher H. Kang; Chun Cheng Tsao

ISTFA 2021; 274-278https://doi.org/10.31399/asm.cp.istfa2021p0274

Abstract

View Articletitled, A New Delayering Application Workflow in Advanced 5nm Technology Device with Xenon Plasma Focus Ion Beam Microscopy

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Fast and Effective Sample Preparation Technique for Backside Fault Isolation on GaN Packaged Devices

Tony Colpaert; Stefaan Verleye

ISTFA 2021; 279-282https://doi.org/10.31399/asm.cp.istfa2021p0279

Abstract

View Articletitled, Fast and Effective Sample Preparation Technique for Backside Fault Isolation on GaN Packaged Devices

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Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry

Rodrigo Delgadillo Blando; Lukáš Hladík; Jozef Vincenc Oboňa; Tomáš Borůvka; Martin Burán; Michael Krause; Boris Arnold Rottwinkel; Scott Fuller

ISTFA 2021; 283-290https://doi.org/10.31399/asm.cp.istfa2021p0283

Abstract

View Articletitled, Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry

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Accelerate Your 3D X-ray Failure Analysis by Deep Learning High Resolution Reconstruction

Allen Gu; Andriy Andreyev; Masako Terada; Bernice Zee; Syahirah Mohammad-Zulkifli; Yanjing Yang

ISTFA 2021; 291-295https://doi.org/10.31399/asm.cp.istfa2021p0291

Abstract

View Articletitled, Accelerate Your 3D X-ray Failure Analysis by Deep Learning High Resolution Reconstruction

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Failure Case Studies of GaAs-Based Oxide-Confined VCSELs

Kuang-Tse Ho; Cheng-Che Li

ISTFA 2021; 296-300https://doi.org/10.31399/asm.cp.istfa2021p0296

Abstract

View Articletitled, Failure Case Studies of GaAs-Based Oxide-Confined VCSELs

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SCM Application and Failure Analysis Procedure for Ion-Implantation Issues in Power Devices

Kuang-Tse Ho; Cheng-Che Li

ISTFA 2021; 301-305https://doi.org/10.31399/asm.cp.istfa2021p0301

Abstract

View Articletitled, SCM Application and Failure Analysis Procedure for Ion-Implantation Issues in Power Devices

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Electrical Screening Method of V-NAND Flash Channel Hole Bending Defects

Dooyeun Jung; Youngha Choi; Jae In Lee; Bu-il Nam; Ki-Young Dong; Bohchang Kim; Eunkyoung Kim; Ki-Whan Song; Jai Hyuk Song; Myungsuk Kim; Woo Young Choi

ISTFA 2021; 306-308https://doi.org/10.31399/asm.cp.istfa2021p0306

Abstract

View Articletitled, Electrical Screening Method of V-NAND Flash Channel Hole Bending Defects

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Creative Approaches for Thermal Hot Spot Identification on Analog IC

Chun Haur Khoo; Zhi Jie Lau

ISTFA 2021; 309-312https://doi.org/10.31399/asm.cp.istfa2021p0309

Abstract

View Articletitled, Creative Approaches for Thermal Hot Spot Identification on Analog IC

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Automated Metrology on the Verticality of Cross-Sectioned Channel Hole at V-NAND with Over 200 Layers by Transmission Electron Microscope

Dong-yeob Kim; Jong-ick Son; Christopher H Kang

ISTFA 2021; 313-315https://doi.org/10.31399/asm.cp.istfa2021p0313

Abstract

View Articletitled, Automated Metrology on the Verticality of Cross-Sectioned Channel Hole at V-NAND with Over 200 Layers by Transmission Electron Microscope

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SRAM Bitcell Defect Identification Methodology Using Electrical Failure Analysis Data

Hyungtae Kim; Geonho Kim; Yunrong Li; Jinyong Jeong; Youngdae Kim

ISTFA 2021; 316-319https://doi.org/10.31399/asm.cp.istfa2021p0316

Abstract

View Articletitled, SRAM Bitcell Defect Identification Methodology Using Electrical Failure Analysis Data

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Advanced Soft Defect Screen Methodology for Nanoscale SRAM Yield Improvement

Pangyum Kim; Hyungtae Kim; Youngdae Kim

ISTFA 2021; 320-323https://doi.org/10.31399/asm.cp.istfa2021p0320

Abstract

View Articletitled, Advanced Soft Defect Screen Methodology for Nanoscale SRAM Yield Improvement

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FA Approach on MIM (Metal-Insulator-Metal) Capacitor Failures

Kuang Shien Lee; Lai Khei Kuan

ISTFA 2021; 324-329https://doi.org/10.31399/asm.cp.istfa2021p0324

Abstract

View Articletitled, FA Approach on MIM (Metal-Insulator-Metal) Capacitor Failures

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Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages

Yi-Sheng Lin; Yu-Hsiang Hsiao; Pei-Yu Tseng; Yu-Jen Chang; Cheng-Hsin Liu; Yu-Ting Lin

ISTFA 2021; 330-333https://doi.org/10.31399/asm.cp.istfa2021p0330

Abstract

View Articletitled, Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages

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Commonality Analysis for Multiple Chain Integrity Failures

Angelo Antonio Merassi; Matteo Medda

ISTFA 2021; 334-336https://doi.org/10.31399/asm.cp.istfa2021p0334

Abstract

View Articletitled, Commonality Analysis for Multiple Chain Integrity Failures

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Enabling Automated Sample Delayering, Imaging, and Probing Prep with an Adaptive Endpointing Workflow

Sean Morgan-Jones; Pete Carleson; Mark Najarian; Gavin Mitchson; Noel Franco; Sophia Weeks; Suri Mandala

ISTFA 2021; 337-341https://doi.org/10.31399/asm.cp.istfa2021p0337

Abstract

View Articletitled, Enabling Automated Sample Delayering, Imaging, and Probing Prep with an Adaptive Endpointing Workflow

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Workflow Solution for Positional Characterization of 3D NAND Channel Tilt/Shift

Mark Najarian

ISTFA 2021; 342-346https://doi.org/10.31399/asm.cp.istfa2021p0342

Abstract

View Articletitled, Workflow Solution for Positional Characterization of 3D NAND Channel Tilt/Shift

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Automated Cell Layer Counting and Marking at Target Layer of 3D NAND TEM Samples by Focused Ion Beam

Jisu Ryu; Seojin Kim; Christopher H. Kang; Jaeheum Baek

ISTFA 2021; 347-351https://doi.org/10.31399/asm.cp.istfa2021p0347

Abstract

View Articletitled, Automated Cell Layer Counting and Marking at Target Layer of 3D NAND TEM Samples by Focused Ion Beam

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P-N Junction Analysis using Electron Beam Induced Current (EBIC) Technique

Lori L. Sarnecki; Regina Kuan

ISTFA 2021; 352-358https://doi.org/10.31399/asm.cp.istfa2021p0352

Abstract

View Articletitled, P-N Junction Analysis using Electron Beam Induced Current (EBIC) Technique

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Non-Visual Defect Identification by Dopant Analysis Method in FinFET Devices

Seungjun Son; Christopher Penley; Jeffrey Hurst; Chris Michon; Yong Guo; Rafael Lainez; Jason Reifsnider

ISTFA 2021; 359-361https://doi.org/10.31399/asm.cp.istfa2021p0359

Abstract

View Articletitled, Non-Visual Defect Identification by Dopant Analysis Method in FinFET Devices

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Practical Methodologies in Restoring Initial Failure Mode and Backside Focused Ion Beam Cross-Section for Defect Visualization

Alvina Jean Tampos; Karl Villareal

ISTFA 2021; 362-365https://doi.org/10.31399/asm.cp.istfa2021p0362

Abstract

View Articletitled, Practical Methodologies in Restoring Initial Failure Mode and Backside Focused Ion Beam Cross-Section for Defect Visualization

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Electro-Optical Probing for Capturing Fast-to-Rise Scan Chain Failures

Karl Villareal; Rommel Estores; Peter Baert

ISTFA 2021; 366-368https://doi.org/10.31399/asm.cp.istfa2021p0366

Abstract

View Articletitled, Electro-Optical Probing for Capturing Fast-to-Rise Scan Chain Failures

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Product Yield, Test, and Diagnostics

Demystifying Unexpected Silicon Responses through User-Defined Fault Models (UDFM) and Failure Analysis

Subhadip Kundu; Gaurav Bhargava; Lesly Endrinal; Lavakumar Ranganathan

ISTFA 2021; 369-376https://doi.org/10.31399/asm.cp.istfa2021p0369

Abstract

View Articletitled, Demystifying Unexpected Silicon Responses through User-Defined Fault Models (UDFM) and Failure Analysis

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Maximizing ATPG Diagnosis Resolution on Unique Single Failing Devices

Andrew Sabate; Rommel Estores

ISTFA 2021; 377-387https://doi.org/10.31399/asm.cp.istfa2021p0377

Abstract

View Articletitled, Maximizing ATPG Diagnosis Resolution on Unique Single Failing Devices

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Improving Diagnosis Resolution with Population Level Statistical Diagnosis

Kun Young Chung; Shaun Nicholson; Soumya Mittal; Martin Parley; Gaurav Veda; Manish Sharma; Matt Knowles; Wu-Tung Cheng

ISTFA 2021; 388-393https://doi.org/10.31399/asm.cp.istfa2021p0388

Abstract

View Articletitled, Improving Diagnosis Resolution with Population Level Statistical Diagnosis

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Genetic Algorithm-Based Digital Test Optimization Method and its Application to Yield Improvement

Y.H. Chan; S.H. Goh

ISTFA 2021; 394-402https://doi.org/10.31399/asm.cp.istfa2021p0394

Abstract

View Articletitled, Genetic Algorithm-Based Digital Test Optimization Method and its Application to Yield Improvement

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Defect Inspection Wafer Notch Orientation and Defect Detection Dependency

Lindarti Purwaningsih; Philipp Konsulke; Markus Tonhaeuser; Helena Jantoljak

ISTFA 2021; 403-405https://doi.org/10.31399/asm.cp.istfa2021p0403

Abstract

View Articletitled, Defect Inspection Wafer Notch Orientation and Defect Detection Dependency

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Wafer Pattern Recognition for Detecting Process Abnormalities in NAND Flash Memory Manufacturing

Jeongin Choe; Taehyeon Kim; Saetbyeol Yoon; Sangyong Yoon; Ki-Whan Song; Jai Hyuk Song; Myungsuk Kim; Woo Young Choi

ISTFA 2021; 406-409https://doi.org/10.31399/asm.cp.istfa2021p0406

Abstract

View Articletitled, Wafer Pattern Recognition for Detecting Process Abnormalities in NAND Flash Memory Manufacturing

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Sample Preparation and Device Deprocessing

Large Area Semiconductor Device Delayering for Failure Identification and Analyses

Pawel Nowakowski; Cecile Bonifacio; Mary Ray; Paul Fischione

ISTFA 2021; 410-413https://doi.org/10.31399/asm.cp.istfa2021p0410

Abstract

View Articletitled, Large Area Semiconductor Device Delayering for Failure Identification and Analyses

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Selective Dry Etch Removal of Si and SiO_xN_y for Advanced Electron Beam Probing Applications

Mary Edmonds; Thaddeus Cox; John Markulin; Martin von Haartman

ISTFA 2021; 414-417https://doi.org/10.31399/asm.cp.istfa2021p0414

Abstract

View Articletitled, Selective Dry Etch Removal of Si and SiO_xN_y for Advanced Electron Beam Probing Applications

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Dielectric Film Thickness Measurement Via a Convolutional Neural Network for Integrated Circuit Delayering End Point Detection

Jonathan Scholl; Nick Darby; Josh Baur; Yash Patel; Isabel Boona; Kurtis Wickey; Jeremiah Schley

ISTFA 2021; 418-422https://doi.org/10.31399/asm.cp.istfa2021p0418

Abstract

View Articletitled, Dielectric Film Thickness Measurement Via a Convolutional Neural Network for Integrated Circuit Delayering End Point Detection

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Impacts of Substrate Thinning on FPGA Performance and Reliability

Darin Leonhardt; Thomas Beechem; Matthew Cannon; Nathaniel Dodds; Matthew Fellows; Thomas Grzybowski; Gad Haase; Thomas LeBoeuf; David Lee; William Rice

ISTFA 2021; 423-429https://doi.org/10.31399/asm.cp.istfa2021p0423

Abstract

View Articletitled, Impacts of Substrate Thinning on FPGA Performance and Reliability

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A Novel Sample Preparation Method for Frontside Inspection of GaN Devices after Backside Analysis

Tony Colpaert; Stefaan Verleye

ISTFA 2021; 430-435https://doi.org/10.31399/asm.cp.istfa2021p0430

Abstract

View Articletitled, A Novel Sample Preparation Method for Frontside Inspection of GaN Devices after Backside Analysis

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Advances in Scanning Microwave Impedance Microscopy

Ravi Chandra Chintala; Nicholas Antoniou; Yongliang Yang

ISTFA 2021; 436-440https://doi.org/10.31399/asm.cp.istfa2021p0436

Abstract

View Articletitled, Advances in Scanning Microwave Impedance Microscopy

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Simultaneous Interface Defect Density and Differential Capacitance Imaging by Time-Resolved Scanning Nonlinear Dielectric Microscopy

Kohei Yamasue; Yasuo Cho

ISTFA 2021; 441-445https://doi.org/10.31399/asm.cp.istfa2021p0441

Abstract

View Articletitled, Simultaneous Interface Defect Density and Differential Capacitance Imaging by Time-Resolved Scanning Nonlinear Dielectric Microscopy

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Fault Isolation Approaches for Nanoscale TSV Interconnects in 3D Heterogenous Integration

K.J.P. Jacobs; A. Jourdain; I. De Wolf; E. Beyne

ISTFA 2021; 446-453https://doi.org/10.31399/asm.cp.istfa2021p0446

Abstract

View Articletitled, Fault Isolation Approaches for Nanoscale TSV Interconnects in 3D Heterogenous Integration

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Quantitative Evaluation of Bonded Silicon Wafer by Scanning Acoustic Tomography

Koutaro Kikukawa; Natsuki Sugaya; Shigeru Ohno; Yoshihiro Tomita

ISTFA 2021; 454-457https://doi.org/10.31399/asm.cp.istfa2021p0454

Abstract

View Articletitled, Quantitative Evaluation of Bonded Silicon Wafer by Scanning Acoustic Tomography

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