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Proceedings Papers
ISTFA 2020
November 15–19, 2020
Event canceled
Conference Sponsors:
- Electronic Device Failure Analysis Society
- ASM International
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ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis
3D Device Failure Analysis
Innovative Base Die Debug Technique with TSV Wirebond for 3D Stack-Die Devices
Wen-Hsien Chuang; Tom Tong; May Ling Oh; Hyuk Ju Ryu; Di Xu; Swaran Kumar; Shuai Zhao; Jennifer Huening; Chia-Yi Chen; Charles W Ladwig; Joshua D Foster; Lacey Badger
ISTFA 2020; 1-5https://doi.org/10.31399/asm.cp.istfa2020p0001
Artificial Intelligence Application for Failure Analysis
Board and System Level Failure Analysis
Case Studies
Yield and Failure Analysis of FinFET Source to Drain Leakage in 12nm Technology
Felix Beaudoin; Satish Kodali; Rohan Deshpande; Wayne Zhao; Edmund Banghart; Rinus Lee; Thirukumaran Mahalingam; Nuh Yuksek; Lu Yuan; Wang Tao; Lillian Li; Sushruth Goud Perumalla; Shweta Arora; Trejo Rust
ISTFA 2020; 38-41https://doi.org/10.31399/asm.cp.istfa2020p0038
Qualification and Selection Philosophy for the SuperCam IRS Photodiode on Perseverance Rover
Sophie Jacquinod; Jean-Michel Reess; Napoléon Nguyen Tuong; Jérôme Parisot; Frédéric Chapron; Kateryna Kiryukhina; Guy Perez; Guillaume Bascoul; Olivier Gilard; Julien Mekki; Marina Heim; Estelle Raynal; Yann Hello
ISTFA 2020; 46-52https://doi.org/10.31399/asm.cp.istfa2020p0046
Bottom Electrode Properties and Electrical Field Cycling Effects on HfOx based Resistive Switching Memory Device
J. Li; Y. Kim; D. Kong; K. Cheng; S. -C. Seo; C. Robinson; N. Saulnier; R. R. Robison; A. J. Varghese; I. Ahsan; R. Muralidhar; T. Ando; V. Narayanan
ISTFA 2020; 53-56https://doi.org/10.31399/asm.cp.istfa2020p0053
Electrical Probing Role in 14nm SOI Microprocessor Failure Analysis
Zhigang Song; Pat McGinnis; Dave Albert; Greg Hornicek; Mike Tenney; Larry Fischer; John Sylvestri; Phong Tran; Chuck Le; Danielle Floyd; Guoda Lian; Steve Boettcher; Malik Ali
ISTFA 2020; 61-66https://doi.org/10.31399/asm.cp.istfa2020p0061
Emerging Failure Analysis Techniques and Concepts
Fault Isolation
FIB Circuit Analysis and Edit
Hardware Attacks, Security, and Reverse Engineering
Microscopy
Nanoprobing and Electrical Characterization
Packaging and Assembly Level Failure Analysis
Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation
Chuan Zhang; Jane Y. Li; John Aguada; Jonathon Elliott; Somayyeh Rahimi; Christian Schmidt; Howard Marks; Tom White; Jesse Alton; Brett Gibson; Martin Igarashi
ISTFA 2020; 245-249https://doi.org/10.31399/asm.cp.istfa2020p0245
Poster Session
Product Yield, Test, and Diagnostics
Enabling Cell Aware Diagnosis in a Foundry for Accurate and Efficient Failure Analysis of Cell Internal Defects
Rohan Deshpande; Gregory Billus; Nikitha Penmethsa; Davide Pacifico; Huaxing Tang; Jayant Dsouza; Randy Klingenberg; Manish Sharma Mentor
ISTFA 2020; 335-337https://doi.org/10.31399/asm.cp.istfa2020p0335
Sample Preparation and Device Deprocessing
Laser Chemical Etching Trench Refinements for Backside Debug Journey to the Circuit Layer
Matthew M. Mulholland; Shida Tan; Muhammad Usman Raza; Matthew Levesque; Jordan Furlong; Christopher G.L. Ferri; Robert Chivas; Michael DiBattista; Scott Silverman
ISTFA 2020; 357-361https://doi.org/10.31399/asm.cp.istfa2020p0357
Cross Sectional Passive Voltage Contrast Approach for Gate Oxide Breakdown Defect Isolation and Visualization for TEM Analysis
S.L. Ting; P.K. Tan; Y.L. Pan; H.H.W. Thoungh; S.Y. Thum; F. Rivai; P.T. Ng; S.J. Moon; D. Nagalingam; T.T. Yu; S.P. Neo; C.Q. Chen
ISTFA 2020; 362-369https://doi.org/10.31399/asm.cp.istfa2020p0362