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Proceedings Papers
ISTFA 2015
November 1–5, 2015
Portland, Oregon, USA
Conference Sponsors:
- Electronic Device Failure Analysis Society
- ASM International
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ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis
IPFA Best Paper
Advanced Methods and Techniques
Fault Isolation and Defect Localization
Sample Preparation and Deprocessing
Turning Sample Into (Re)Solution—Focused Ion Beam Shaped Solid Immersion Lenses
Philipp Scholz; Michael Sadowski; Christian Boit; Sebastian Kupijai; Marvin Henniges; Christoph Theiss; Stefan Meister; David Stolarek; Harald H. Richter; Mahyar Boostandoost
ISTFA 2015; 71-75https://doi.org/10.31399/asm.cp.istfa2015p0071
Scanning Probe Analysis
Circuit Edit
System Level Analysis
Microscopy
3D Devices and Packages
Counterfeit Microelectronics
In-Line Metrology and Inspection
Poster Session
IR Thermography for Temperature Measurements and Fault Location on AlGaN/GaN HEMTs and MMICs
Lény Baczkowski; Franck Vouzelaud; Dominique Carisetti; Nicolas Sarazin; Jean-Claude Clément; Jean-Claude Jacquet; Christophe Gaquiére; Benoit Lambert; Laurent Brunel
ISTFA 2015; 253-257https://doi.org/10.31399/asm.cp.istfa2015p0253
Product Yield, Test, and Diagnostics
Device Failure Analysis
Nanoprobing
Plasma FIB DualBeam Delayering for Atomic Force NanoProbing of 14 nm FinFET Devices in an SRAM Array
Roger Alvis; Trevan Landin; Chad Rue; Peter Carleson; Oleg Sidorov; Andrew Erickson; Sean Zumwalt; Sinjin Dixon-Warren; Wan-Yi Liu; Shih-Hsin Chang; Te-Fu Chang; Chia-Hsiang Yen; Pau-Sheng Kuo; Chih-Hsun Chu
ISTFA 2015; 388-400https://doi.org/10.31399/asm.cp.istfa2015p0388